Siemens, Intel Foundry boost 18A PDK
Summary
Intel 18A represents a significant technological leap forward, featuring innovative RibbonFET Gate-all-around transistors and the industry’s first PowerVia backside power delivery. By integrating Siemens expertise with our technology, were not only streamlining design workflows but also creating pathways for our mutual customers to bring groundbreaking innovations to market faster and more efficiently." Siemens has also announced the certification of a comprehensive reference workflow for Intel Foundry’s Embedded Multi-die Interconnect Bridge-T (EMIB-T) with Through Silicon Via technology. The workflow is driven by Siemens’ Innovator3D IC solution, which provides a consolidated cockpit for constructing a digital twin -- featuring a unified data model for design planning, prototyping and predictive analysis -- of the complete semiconductor package assembly. Together, we are poised to accelerate development cycles and push the boundaries of semiconductor technology, creating groundbreaking solutions that meet the growing demands of the industry."
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