MCU Roundup: New Connectivity Options for Industry 4.0 and Beyond - News
Summary
To address these challenges and cater to the needs of emerging applications, semiconductor manufacturers are coming up with state-of-the-art microcontroller platforms, software, and modules that accelerate the development of connected systems. Texas Instruments (TI) recently announced new Matter-enabled software development kits (SDKs) for Wi-Fi and Thread MCUs, such as the CC3235SF and CC2652R7. Matter is an IoT protocol developed by the Connectivity Standards Alliance that runs on Thread and Wi-Fi network layers and uses Bluetooth Low Energy to communicate between different ecosystems. Image used courtesy of STMicroelectronics The module integrates a chip antenna, its matching circuity, an SMPS, and ultra-low power modes for extended battery life. STs new module is already helping new products, including I-Care Groups Wi-Care sensors, which are continuous asset monitoring systems.
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