Siemens partners with TSMC for 3nm product certifications and other technology milestones
Summary
“Our latest collaboration with Siemens can better enable next-generation silicon and system innovation for high performance computing (HPC) and mobile applications. We look forward to continuing to provide our mutual customers with best-in-class technologies and solutions for optimized performance, power, and area, and help them get to market on time.” Siemens’ industry-leading Calibre® nmPlatform tool for IC physical verification sign-off is fully certified for TSMC’s advanced N4P and N3E processes. Accurate and efficient high-frequency extraction of transmission line-like structures, as well as interposers’ high-speed signal buses connecting High Bandwidth Memories (HBMs) and SoCs that are critical in todays advanced process designs were demonstrated in 3DFabric design-enablement qualifications. Mutual customers can employ these methods to help achieve optimal performance when using the Calibre platform on Azure, to get their designs to production faster. Siemens software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn todays ideas into the sustainable products of the future.
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