Wafer Level Packaging Scales Favorably with the Trend to Manufacture on Ever Increasing Wafer Diameters
Summary
Company Overview Products & Services Contact Info & Offices Press Releases Electronics.ca Publications Press Release Receive press releases from Electronics.ca Publications: By Email RSS Feeds: Wafer Level Packaging Scales Favorably with the Trend to Manufacture on Ever Increasing Wafer Diameters Due to the amazing learning curve of the semiconductor industry in terms of chip density versus cost improvements over time, there is a widening gap between the scaling evolutions of the chip front-end and the packaging-assembly manufacturing industries.While it is said to be difficult to estimate what is the real status of volume production for WLP, this new packaging report available at Electronics.ca Publications aims at giving clues for understanding the technologies, trends and market status of WLP in Semiconductor ICs, CMOS imagers and MEMS applications.According to the report, it is forecast the technology could penetrate about 63% of this market as of 2012 as it will progressively widespread from CIF/VGAs to higher resolution image sensors.Details of the new report can be found on Electronics.ca Publications web site: http://www.electronics.ca/reports/semiconductor_manufacturing/wlp.html ### Montreal, Canada, February 21, 2008 --( PR.com )-- Electronics.ca Publications, the electronics industry market research and knowledge network, announces the availability of a new report entitled "WLP & Embedded Die Technologies 2008".Due to the amazing learning curve of the semiconductor industry in terms of chip density versus cost improvements over time, there is a widening gap between the scaling evolutions of the chip front-end and the packaging-assembly manufacturing industries.According to the report, it is forecast the technology could penetrate about 63% of this market as of 2012 as it will progressively widespread from CIF/VGAs to higher resolution image sensors.Moreover, semiconductors integrated circuits represent the largest potential for WLP.