Semiconductor players to advance next-gen FD-SOI roadmap for automotive, IoT and mobile applications
Summary
CEA has also a long history of deep R&D cooperation with both STMicroelectronics, Soitec and GlobalFoundries and has been very active in the initiatives led by the European Commission and Member States aiming to set up a complete ecosystem for FD-SOI going from material suppliers, design houses, EDA tools providers, fabless companies and end users”, said François Jacq, CEA Chairman. “CEA is highly motivated by this opportunity to prepare a new generation of FD-SOI technology providing higher performance, lower power consumption and lower costs to address the needs of major European markets such as automotive, IoT, 5G/6G and manufacturing 4.0.” "FD-SOI is a key technology for the dynamic markets we address and an important growth driver for our industry and our customers,” said Paul Boudre, CEO of Soitec. "The FD-SOI alliance that we are pleased to announce today is built on Soitec’s capacity to drive innovation in substrates and help launch a new generation of semiconductors serving a large variety of markets including connectivity, automotive, Internet of Things and artificial intelligence. This collaboration also illustrates how closely we work with our customers to advance technologies, address their future needs, and accompany them to go to market at a high pace.” “We look forward to deepening our partnership with the leading French and Europeanstakeholders across the full semiconductor value chain and in particular to build on our highly differentiated FDSOI-based solutions together to address the rapid growth of chips requiring low power, connectivity, and security in automotive, IoT and smart mobile devices,” said Tom Caulfield, CEO of GlobalFoundries. “We look forward to working with other leading experts on the next generations of FD-SOI that will enable our customers to overcome the challenges they face as they transition to full digitalization and support the decarbonisation of the economy”.