Development of next-gen wireless MCUs supporting New Bluetooth 5.3 LE
Summary
The new products will be supported by the RA family’s Flexible Software Package (FSP) for easy development of applications and the Renesas QE for Bluetooth LE plug-in, a dedicated Bluetooth profile and application development support tool. The RA family’s high level of security and safety mechanisms, including TrustZone support, is also part of these new products. “We are committed to providing the best performance, ease-of-use, and the latest features on the market,” said Roger Wendelken, senior vice president in Renesas’ IoT and Infrastructure Business Unit. “By offering early, robust support for the Bluetooth 5.3 LE specification, we will enable our RA customers to be first to market with their next-generation products.” Renesas is preparing to offer multiple Winning Combinations featuring the new Bluetooth 5.3 LE MCUs along with complementary analog, power and timing devices. The new MCUs are being developed using an advanced manufacturing process that will enable high-performance, low power consumption and small package options.