eYs3D Microelectronics raises $7m in Series A funding
Summary
eYs3D was spun off from Etron Technology in 2016 and this new investment will allow it to build out its embedded chip business in additional markets and bring the startup to the next level. Among the investors ARM will work with eYs3D to focus on the integration of its chips with ARMs CPU/NPU processors; while WI Harper Group will provide access to its large industrial partners base and ecosystem; and Marubun, a global distributor, joined the funding round to open up new distribution channels for the company. The computer vision market for AI is critical in enabling autonomous functionalities for software and machines, from robotic spatial awareness to scene understanding of edge devices and, according to Meticulous Research, the 3D and machine vision market is expected to double from $1.35bn in 2020 to $2.65bn in 2027. eYs3D designs processor ICs for AI at the edge and its technology allows for more sophisticated human/machine coordination. In order to address specific growing markets such as artificial intelligence of things (AIoT) and mobile intelligence, eYs3D uses an innovative silicon design approach with algorithms to integrate and manage information from differing sensor sources including thermal, active 3D sensing and neural network perception. This "sensor fusion" enables the design of systems for applications incorporating visual simultaneous location and mapping (VSLAM), object feature depth recognition and gesture-based commands.