RF solution to develop next-generation 5G IoT platform
Summary
“The Cadence Virtuoso Layout Suite EXL, powered by the Cadence EMX Planar 3D Solver, gives our engineers advanced capabilities within a single unified design environment that greatly improves design team efficiency for meeting aggressive schedule goals. Integrating the EMX Planar 3D Solver directly into the Virtuoso Layout Suite EXL environment empowered Sequans engineers to efficiently design and verify critical on-chip and off-chip passive devices and interconnect. The multi-technology capabilities of the Virtuoso RF Solution let integrated circuits (IC)s, packages and boards be combined and co-designed within a single, unified design platform, thereby significantly reducing EM setup time and effort and allowing designers to meet the growing EM requirements of 5G, IoT and other advanced communication standards. Additionally, the seamless interplay of advanced simulation, multiphysics and RF technologies within the Cadence solution delivers a one-of-a-kind, comprehensive and extensible platform for chip, package and board design through to the end-to-end complete system design, analysis and signoff. “The Cadence Intelligent System Design strategy, which enables customers to design from chips to packages/boards and large electrical systems more efficiently, continues to gain momentum globally with Sequans being one of the latest companies to embrace the Cadence RF solution,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence.