ATS Successfully Demonstrates Air Cooling System, Therm-Jett, for Blade Servers in Cloud Computing
Summary
Lab tests have demonstrated that four heat sinks on four simulated chips located on a PCB have achieved 0.16 to 0.18 C/W thermal resistances.The power dissipation of each simulated component was tested at 200 W. This compares very favorably versus the thermal resistances of the same heat sinks with parallel flow using the same fans.The power dissipation of each simulated component was tested at 200 W. This compares very favorably versus the thermal resistances of the same heat sinks with parallel flow using the same fans.A key advantage of Therm-Jet is there won’t be a need to make a special duct for each heat sink freeing the other board for other components.ATS has a white paper available on their Therm-Jett technology.To get a free copy from them, email joday@qats.com requesting their Therm-Jett white paper.ATS is a leading engineering/manufacturing company focused on innovations in the thermal management of electronics.