Fibocom pionero en suministrar muestras de ingeniería de módulo 5G en plataforma de chipset de MediaTek

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Fibocom releases its latest 5G module FG360 during the CES 2021 event. The module supports 5G Sub-6GHz 2CC Carrier Aggregation 200MHz frequency and 5G + WiFi-6 connectivity to provide a high-speed and low-latency 5G network experience. Engineering samples of the module will be available in January. Fibocom will be the first in the industry to provide engineering samples of 5G modules based on the MediaTek chipset platform. (Photo: Business Wire)

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