Atrenta & TSMC Announce Next Generation IP Kit
Summary
SAN JOSE, Calif.--(BUSINESS WIRE)--Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries today announced the availability of IP Kit 3.0. “The new capabilities will provide even more confidence and visibility into the metrics of quality and performance that our customers have come to expect.” The IP Kit 3.0 has been available for download from TSMC Online starting May 22nd, 2015. Patented solutions provide early design insight into the demanding performance, power and area requirements of the complex system on chips (SoCs) fueling todays consumer electronics revolution. More than two hundred eighty companies and thousands of design engineers worldwide rely on SpyGlass to reduce risk and cost before traditional EDA tools are deployed. With the addition of GenSys® and BugScope®, RTL modification and verification efficiency are also enhanced, allowing engineers and managers to find the fastest and least expensive path to silicon for complex SoCs.
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