TDK Showcases Solutions for Automotive, AR/VR, IoT, Mobile and Wearables at CES 2019
Summary
SAN JOSE, Calif.--(BUSINESS WIRE)--TDK Corporation (TSE:6762) will present the industry’s single source of innovative sensor, passive components and electronics solutions marketed under brands TDK, InvenSense, Micronas, Chirp, Tronics and EPCOS in Booth #30306, Las Vegas Convention Center, South Hall 3, at CES 2019, January 8-11, Las Vegas, Nev. To meet the growing industry demand to humanize the digital experience, TDK is advancing new materials, achieving production process control at nanometer levels, and manufacturing to zero defect standards, to offer passive components, sensors, sensor solutions and platforms for mobile, wearable, AR/VR, automotive, Internet of Things (IoT), drone and industrial applications. At the forefront of pioneering six degrees of freedom (6DoF) solutions, TDK delivers InvenSense core competencies of 6-axis motion sensing with Chirp sonar and high-performance TMR magnetometers in a single platform integrated with fusion software. Available in two forms, as a single layer monolithic piezo ceramic disk and as a multilayer actuator with mechanical amplifiers, these new active haptic solutions with “button-like” feedback feature very low-insertion heights tailored for a comprehensive range of consumer/industrial displays as well as for automotive use. PowerHap actuators feature high acceleration and force, low insertion height and a fast response time for use in automotive flat panel consoles, single button replacement and navigation systems; consumer electronics displays (e.g., flat panel TVs, smartphones and tablets, AR/VR, game controllers and wearables); smart appliances and industrial displays. TDK’s comprehensive portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices.