ConnectUs Technologies Joins Telecom Infra Project and Announces Cloud Wi-Fi Interoperability with TIP’s Open Access Point
Summary
OTTAWA, Ontario--(BUSINESS WIRE)--ConnectUs Technologies announces interoperability between its Wi-Fi Cloud Modular Application Platform (CMAP) and a variety of Access Points from several vendors running TIP’s Open AP software. A demonstration originally planned at Mobile World Congress 2020 at the Telecom Infra Project (TIP) booth will be rescheduled for a future event. “Adapting the CMAP platform to work with TIP products will allow Wi-Fi providers to bring unprecedented innovation, quality of experience and cost reductions to enterprises large and small,” said Bernard Herscovici, CEO of ConnectUs Technologies. Over the past four years, TIP has driven substantial innovation across all elements of the network including Access, Transport, Core & Services, while spanning urban through to rural market use cases. To date, it has 13 Community Labs which test, validate and integrate solutions, embarked on field trials in Africa, Latin America, Middle East and Europe.