SÜSS MicroTec and BRIDG join forces to establish a production-level Applications Center in North America
Summary
This partnership puts an unprecedented array of SUSS MicroTec equipment and fabrication technologies at the doorstep of its North American customer base, readily accessible for demonstrations and evaluations. "This partnership will play an integral role in BRIDGs performance, especially for our recently announced contract with the Department of Defense IBAS program. " Both companies plan to expand the relationship already established with the further installation of SUSS production tools to offer additional advanced manufacturing capabilities for 200mm wafer processing. We meet their requirements from A to Z by enabling direct access to facilities, technical innovation and professional management in a 200mm manufacturing environment," stated Gary Choquette, General Manager, SUSS MicroTec Inc. About BRIDG BRIDG is a not-for-profit, public-private partnership specializing in advanced system integration and packaging, digital and RF silicon interposers, microelectronics production, and III-V materials growth for sensors, optoelectronics, and high-speed transistors. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing.