Kandou to Demonstrate 500Gbps USR Glasswing PHY at DesignCon 2018
Summary
On Tuesday at 4:45 PM, Kandou and Marvell will participate in a panel introducing the USR Alliance, an industry consortium that is forming to address the specific challenges of integrating multiple die inside a shared package.Kandou will be in booth 314 on the show floor at DesignCon 2018 at the Santa Clara, Convention Center, which is open January 31 st and February 1st from noon to 6:00 p.m. each day.In Track 01 on Tuesday afternoon from 4:45 – 6:00 PM, Kandou Founder and CEO Amin Shokrollahi and VP of Standards Brian Holden will participate in the panel “USR Alliance: The MCM is the New PCB.”Headquartered in Lausanne, Switzerland and founded in 2011, Kandou Bus is an innovative interface technology company specializing in the invention, design, license and implementation of unmatched chip-to-chip link solutions.Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies.