He Tingbo: The woman who wants to change the chip industry
Summary
The article profiles He Tingbo, the Huawei executive leading the company’s semiconductor efforts, and explains her role in shaping Huawei’s chip strategy. It focuses on her proposed Tau scaling law, which aims to extend chip performance by stacking circuits vertically and reducing signal travel time instead of shrinking transistors further. The piece also places her work in the context of U.S. sanctions, Huawei’s push for self-sufficiency, and the company’s heavy R&D investment. Analysts view the concept as intriguing but still uncertain because 3D chip stacking brings heat, yield, and cost challenges. The article also highlights her career path and long tenure at Huawei.
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