AttoTude Secures $52M in Series C Funding Round to Accelerate Interconnect Technology for Hyperscale Infrastructure

Funding Rounds

Summary

AttoTude raised $52 million in Series C funding to speed up commercialization of its ASIC over Dielectric interconnect technology for AI infrastructure. The round included both new strategic investors and existing backers, bringing total funding to $143 million. The company plans to use the capital to build prototypes, develop its first product, and establish a scalable supply chain. AttoTude is targeting hyperscale and AI infrastructure customers that need higher-bandwidth, lower-power connectivity than copper or optical alternatives can deliver.

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Amount $52.0M Total raised
Date June 15, 2026 Announcement date
Investors Sutter Hill Ventures, Canaan Partners, The Westly Group, Mayfield, AllegisCyber Capital, Wing Venture Capital, Draper Nexus Venture Partners Lead investors
Company attotude.com Funded company

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