Google Is Considering Using Intel's EMIB Technology in the New TPUv8e Chip
Summary
Google is considering Intel Foundry’s EMIB packaging technology for its next-generation TPUv8e AI accelerator. The move would give Google a lower-cost and more flexible alternative to TSMC’s CoWoS approach. The article also notes that Google keeps a modular design strategy by splitting compute, I/O, and back-end responsibilities across different partners. TPUv8e and related TPU programs are expected to move toward production in the 2027 timeframe, with formal announcements likely before then.
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