India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

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Andhra Pradesh is positioning itself as a semiconductor packaging hub and treating packaging as its immediate entry point into the chip supply chain. Officials say packaging work is already underway, while wafer fabrication remains a much longer-term goal. Indian states are also using Computex in Taipei to attract Taiwanese electronics and AI supply chain investment. The roundup also notes that Indian chip startups are moving from research into customer pilots and that Intel has signed an MoU for advanced glass substrate manufacturing in Odisha.

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