SK Hynix and TSMC deepen AI memory cooperation

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SK hynix and TSMC expanded their collaboration around next-generation AI memory during the Taipei International Computer Show. The companies agreed to broaden cooperation on HBM4E development and advanced packaging. SK hynix also showcased an HBM4E 48GB 12Hi sample with 4.0TB/s bandwidth, which is 38% faster than the previous generation. In the same event, the company unveiled its first DRAM-less PCIe Gen5 client SSD, PVF01. The announcement reinforces both companies’ push to strengthen their position in customized AI memory and storage markets.

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