Optical interconnect technology company Guanglian Xinke announces completion of nearly 500 million yuan Series A financing

▤ Summary

光联芯科 announced that it raised nearly 500 million RMB in Series A financing within one month. The company develops optical interconnect technology for chip-to-chip communication, with a focus on high-performance computing. The round drew lead investment from GSR Ventures, Lenovo Capital, and Cornerstone Capital, along with participation from several strategic and individual investors. Existing shareholders also increased their investment significantly. This financing gives the company more resources to advance its optical I/O technology and scale commercialization.

$ Funding

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