#eic #siliconsaxony #chipdesign #agenticai | Last Mile Semiconductor

Funding Rounds

Summary

Last Mile Semiconductor has closed a financing round with support from TGFS Technologiegründerfonds Sachsen, EIC Fund, and MBG. The company will use the new capital to speed up development of its wireless system-on-chip platform. Its LM10XX chip family targets secure, energy-efficient connectivity for smart metering, industrial systems, smart cities, and other connected devices. The company also positions its chips as infrastructure for agentic edge AI, where processing happens on-device instead of in the cloud. The news highlights both the startup’s progress and the broader push for sovereign European chip design.

$ Funding

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Amount - Total raised
Date December 12, 2025 Announcement date
Investors MBG, TGFS - Technologiegruenderfonds Sachsen Lead investors
Company https://www.lm-semi.com/ Funded company

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