LIDROTEC Raises $13.5 Million to Revolutionize Chip Singulation - Gründerfonds Ruhr

▤ Summary

LIDROTEC raised $13.5 million in a Series A-2 round to scale its laser-based chip singulation technology. The company builds high-precision systems that reduce damage, heat effects, and particle defects during grooving and dicing. The new capital will help it accelerate product development, commercialize its solution, and expand its team. LIDROTEC plans to serve compound semiconductor and leading-edge semiconductor markets, where yield and throughput improvements matter most.

$ Funding

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