Nordson develops panel-level packaging solution | Electronic Specifier
Summary
Nordson developed a panel-level packaging solution for semiconductor manufacturing. The company demonstrated the process with Powertech Technology, Inc. and showed underfill yields above 99% while moving from wafers to panels. Nordson says its ASYMTEK Vantage Series and IntelliJet systems reduced cycle time and improved fluid control and warpage mitigation. The solution supports advanced semiconductor packaging needs for AI, HPC, and chiplet-based architectures.
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