Sarcina Technology advances photonic package design | Electronic Specifier

▤ Summary

Sarcina Technology is advancing photonic package design to support higher-bandwidth, lower-power data center interconnects. The company targets the limitations of copper by integrating optical components closer to switch ASICs inside a package. Its approach focuses on signal integrity, optical alignment, thermal control, and mechanical reliability. Sarcina positions its co-packaged optics and silicon photonics design capabilities as a way to help data centers handle AI-driven traffic growth more efficiently.

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