KOTEI, SemiDrive team up on new R&D model for chip & software-enabled smart cabin
Summary
Shanghai (Gasgoo)- On April 29, KOTEI and SemiDrive officially signed a strategic cooperation agreement, marking a major step toward jointly advancing next-generation intelligent cockpit and vehicle control development. The duo jointly create a near-production-ready intelligent cockpit solution, built on SemiDrives high-performance X9 smart cockpit SoC and its independently developed, automotive-grade E3 MCU series, and powered by KOTEIs A²OS vehicle operating system designed for centralized computing architectures. The solution enables efficient integration of core functions such as the center control system, instrument cluster, DVR, and AVM. Looking ahead, as AI large models become increasingly integral to vehicle electronics and automotive-grade chips grow in computing power, the companies plan to deepen their cooperation. This will be driven by SemiDrives high-performance E3 MCU series and KOTEIs AutoSAR-compliant ZCU software system and high-reliability motor control algorithms.