ASMPT to present bonding solutions at OFC 2025
Summary
“We have been exhibiting at this event, the world’s most important congress and exhibition for optical communication technology, IT and software, for many years and will once again present forward-looking solutions this year.” One key feature of the ASMPT booth will be the AMICRA NANO high-precision die and flip-chip bonder, which was specially developed for the production of innovative communication components that feature optical and electronic components co-packaged in a single housing. Offering exceptional process stability, a placement accuracy of ±0.2 μm @ 3 σ, bonding forces ranging from of 0.1 to 20 N and a throughput rating of up to 400 components per hour, the AMICRA NANO is setting new standards. The machine employs an innovative hybrid bonding technology that does not require any solder or glue but uses atomic diffusion to create stable mechanical and electrical connections. Hybrid bonding will soon be essential in applications that require maximum performance in the smallest of spaces – for example, in high-performance and quantum computers, AI systems, IoT devices, or autonomous vehicles. Visitors to the companys booth will also be able to find out more about the MEGA multi-chip bonder, a state-of-the-art platform that integrates multiple chips in a single housing with the unequaled precision of ±2 μm.