ASMPT presents Vortex II
Summary
“High-resolution, ergonomic LED displays in modern cars ensure drivers have all important and safety-relevant information in view at all times,” said Jonathan Ku, Senior Director of Business Development, ASMPT. “This is where very small LEDs are used, which have to be assembled highly precisely and reliably – because customers from the automotive industry do not accept reworked products. It is exactly for such demanding tasks that we designed and developed Vortex II.” The highly innovative die bonder can process Mini LEDs with a minimum size of 2 mil × 4 mil (50 µm × 100 µm), for example for direct view RGB LED displays with ultra-fine pitch. Process stability and high one-pass rates, even at maximum throughput, are guaranteed by an automatic correction function combined with ASMPTs patented bond head technology. Due to fully automatic RGB wafer handling, this enables one-stop production and highly effective bin mixing and therefore uniform screen colours.