Indium highlights Au die-attach preforms at SPIE Photonics

▤ Summary

For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. AuLTRA 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste, optimised to handle the elevated processing temperatures of gold-based alloys. Perfect for high-power LED module array assemblies, it ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA 3.2 delivers superb wetting and low voiding. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes.

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