Honda and Renesas to develop high-performance SoC for SDVs

▤ Summary

The agreement was announced during a Honda press conference held at CES 2025 in Las Vegas, Nevada on 7th January 2025. To achieve this, the ECU requires a SoC that provides higher processing performance than traditional systems, while minimising any increase in power consumption. The SoC chiplet solution will provide the AI performance required for advanced functions such as AD, while keeping power consumption low. Chiplet technology allows flexibility to create customised solutions and offers future upgrades for functional and performance improvements. This agreement will accelerate the integration of advanced semiconductor and software innovations into the Honda 0 Series, enhancing the mobility experience for customers.

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