SJSemi closed $700M new financing to further boost its Advanced Packaging projects
Summary
JIANGYIN, China, Dec. 31, 2024 /PRNewswire/ -- SJ Semiconductor Corporation (hereinafter referred to as "SJSemi" or "the company") announced the efficient and successful closure of a new financing round amounting to $700 million on Dec. 31, 2024. Complementing this, SJSemi extends its service to offer advanced packaging and testing services for the whole process of wafer level advanced packaging and multi-die integration processing, which are widely used in smartphones, 5G communication, high-performance computing, data centers, automotive and other electronics fields. In the wake of the artificial intelligence and digital economy boom, SJSemi is able to provide a variety of advanced packaging solutions for Chiplet production and continues to increase investments in innovation and R&D efforts, especially in the 3D multi-die integration space.In 2023 and 2024, SJSemi witnessed remarkable revenue growth for two successive years. "Established in August 2014, SJ Semiconductor Co., Ltd. is the first Middle-End-Of-Line (MEOL) pure play foundry equipped with Front-End-Of-Line (FEOL) manufacturing and quality system, serving global customers. Headquartered in Jiangyin High-tech Industrial Development Zone, China, the company has branches in Shanghai and Silicon Valley of the United States, serving advanced chip design enterprises at home and abroad.