The Persistence of (High Bandwidth) Memory: Semiconductor Manufacturing Equipment and Korean Semiconductor Manufactures Face Harsher Restrictions Under New HBM Rules
Summary
On December 2, 2024, the Department of Commerce, Bureau of Industry and Security (BIS) issued a new set of regulations targeting semiconductors manufacturing equipment (SME) and high-bandwidth memory (HBM) chips. In the race to artificial general intelligence, advanced-node semiconductors play an outsized role in a country or company’s ability to progress. At the same time, the targeted precision of the rules has also created gaps in the coverage of the restrictions that has left some scratching their head as to whether these are intentional. We will, of course update as new regulations develop, including one specific to AI technology that we hear may be released before the change in the U.S. presidential administration. [1] While GPUs are typically used in AI development for their parallel processing capabilities, the regulations will capture any integrated circuit that meets the performance thresholds.