EnSilica plc Announces New Debt Facility

Funding Rounds

▤ Summary

EnSilica announced that it has secured a new debt facility to refinance its existing external loan facilities, providing total funding of up to \xa39 million and extending out to November 2029. The Facility has been agreed with Lloyds Bank Group plc, providing the Company with additional flexibility to underpin ongoing working capital commitments, and ensuring that EnSilica can fully capitalise on its existing new business pipeline. The Facility consists of a three-year \xa33 million repayment term loan facility and a five-year \xa33 million revolving credit facility with an accordion option for an additional \xa33 million subject to credit approval by the lender.The Facility also improves the borrowing costs of the Company. The Facility agreements contain normal market terms and financial covenants.

$ Funding

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Amount $11.7M Total raised
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Date November 4, 2024 Announcement date
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Investors - Lead investors
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Company http://www.ensilica.com Funded company

▥ Classifications

industries
Manufacturing Industry
applications
AI & Machine learning

◇ AskAI Classifications

Labels
Semiconductor ASIC Design Mixed Signal IC Design

▦ Linked Companies

EnSilica
$10M to $25M