Innovative bonding technologies for AI and electromobility
Summary
With hybrid bonding and silver sintering we are opening up new opportunities in these fields.” Exploiting the power of future high-performance computers and AI systems to the fullest requires extremely fast fibre-optic data links. With a placement accuracy of ±0.2 µm, several integrated heating systems and a high-purity processing environment, the AMICRA NANO is extremely flexible and can be used for various bonding technologies. With videos and sample products, ASMPT will show at this year’s electronica how the sintering process can be used to create temperature-resistant and highly conductive connections in power electronics. The versatile SilverSAM platform uses a combination of pressure, temperature, and time to bond silver particles in the previously applied paste. The SilverSAM platform thus combines flexibility, productivity, and high sintering quality, making it ideal for applications in modern power electronics.