Indium will participate in IEMT
Summary
Indium Corporation is pleased to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), to be held from 16-18 October in Penang, Malaysia. Five of Indiums experts will present their pioneering research on Pb-free soldering solutions, which tackle key challenges in modern power electronics and advanced packaging applications. Dr Dongkai Shangguan, Strategic Advisor at Indium Corporation, will deliver a keynote address titled Materials and Reliability for Advanced Packaging and Heterogeneous Integration. This presentation will showcase copper (Cu) sintering pastes designed for high-power applications, providing advantages such as low cost, high thermal and electrical conductivity, and the elimination of precious metal plating like gold or silver. Assistant Product Manager for Power Electronics, Sunny Neoh, will give a poster presentation on Low- and Mid-Temperature Pb-Free Solder Preform Technology in Substrate Attach Applications for Improved Thermomechanical Performance.