Samtec will showcase interconnect solutions at OCP Summit
Summary
The summit will take place in San Jose, California, from 15-17 October 2024, and focuses on driving innovation that leads to practical, real-world solutions. Samtec works closely with its customers and partners to develop innovative interconnect solutions that address specific real-world challenges. This module features 16 FireFly optical transceivers, delivering an aggregate throughput of 1.6 Gbps. The FireFly OCP OAI EXP Module also benefits from technology provided by US Conec, whose very small form factor (VSFF) MMC optical connectors allow Samtec to achieve the high fibre density required for the OCP card form factor. US Conec’s DirectConec™ push-pull boot technology ensures effortless insertion and removal of connectors in dense environments.