EnSilica to design ASICs for next-generation telecom equipment

General News

Summary

This joint development will enable the Italian company to enhance the portfolio with remarkable technological evolutions and new products in line with the targets of its IPCEI EMISPHERE programme. EnSilica’s extensive expertise in developing high-performance radio frequency and complex digital systems and its robust and well-documented supply chain management capabilities were pivotal in securing the ASIC contract. As the demand for even higher data rates and the push for more power-efficient systems increases at pace, ASICs are becoming essential for the next generation of terrestrial and satellite telecommunications equipment,” commented Paul Morris, VP RF and Communications Business Unit at EnSilica. Ian Lankshear, Chief Executive Officer of EnSilica, added: “This significant contract marks the beginning of what we hope will be a long-term and mutually beneficial partnership with a key telecoms client. Our ability to both develop and deliver highly complex solutions continues to drive some of the worlds leading equipment manufacturers to select EnSilica as the partner of choice.”

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industries
Manufacturing Industry
applications
AI & Machine learning

AskAI Classifications

Labels
Semiconductor ASIC Design Mixed Signal IC Design

Linked Companies

EnSilica
$10M to $25M