Next-gen connectivity with high-precision CPO technology
Summary
At booth B126, the company will showcase its latest technological advancements in Silicon Photonics and Co-Packaged Optics (CPO) solutions, designed to enhance bandwidth density, improve energy efficiency, and optimise connectivity in modern data centres. By utilising advanced packaging techniques, CPO minimises electrical interconnect lengths and enhances performance, making it ideal for high-speed data transmission in applications such as AI, IoT, and 5G. Dr. Johann Weinhaendler, General Manager at ASMPT AMICRA, stated: “Many electronics manufacturers are upgrading their lines to meet the growing demand in areas like optoelectronics or advanced packaging, particularly in the silicon photonics sector.” The production of Co-Packaged Optics presents several challenges, including the precise alignment of optical and electronic elements and ensuring reliability under diverse conditions. ASMPT is addressing these hurdles through advanced manufacturing technologies that facilitate high-precision bonding, ensuring effective integration of components and leading to enhanced stability and performance in CPO applications. Engineered to optimise production efficiency, it offers shorter cycle times and increased automation, making it an ideal solution for the rigorous demands of CPO manufacturing.