Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules
Summary
The result is the new, proprietary MagPack integrated magnetic packaging technology for power modules that provides previously unachievable performance levels for designers of industrial, enterprise and communications applications. Power modules typically contain semiconductors attached to a substrate and a separate inductor that stores energy in a magnetic field and helps smooth the flow of electricity. Recognizing this dilemma, the team combined the inductor with the integrated circuit to conserve volume and increase power density. It was both exciting and a “ton of pressure,” said John Carlo Molina, a packaging engineering manager in the Philippines who led the manufacturing effort. “My personal goal is to continue to expand the markets we can go after and eventually meet the industry standards necessary to have it be an automotive-qualified technology,” Anton said.