3D camera module advances THT inspection
Summary
This latest innovation, a state-of-the-art 3D camera module, revolutionises failure detection and at the same time significantly reduces the false call rate when measuring critical THT solder joints. In addition to the 3D measurement of THT pins and its solder joints, this higher resolution makes it possible to inspect SMD components up to the package size 0201. Another groundbreaking innovation of this camera module is the integration of a reflection reducer, which significantly increases data quality in critical layout situations during 3D measurements on the solder side of the assembly. To avoid this, GÖPEL electronic has integrated a "Reflex Reducer" into the 3D camera module, which eliminates this disturbing effect and increases the reliability of the 3D measurement. The PILOT AOI system software offers the user a high level of operating convenience and maximum failure detection thanks to different inspection methods.