Media Alert: Cadence to Exhibit Its SI/PI, Advanced IC Packaging and IP Solutions at DesignCon 2019
Summary
WHAT: Cadence experts are scheduled to discuss new developments in these technologies and how they can help solve today’s SI challenges during the following tutorials, panels and sessions: Tutorial: Advanced IBIS-AMI Techniques for 32GT/s and Beyond, Tuesday, January 29 at 9:00 a.m., presented by Cadence and IBM Tutorial: Lowering the Barrier to Entry for Electronic/Photonic ICs, Tuesday, January 29 at 9:00 a.m., presented by Cadence, Lumerical and TowerJazz Panel: Photonics Coming of Age: The Emergence of PDKs, Tuesday, January 29 at 4:45 p.m., presented by Cadence, Lumerical, Mentor, TowerJazz, Hewlett Packard Enterprise and SMART Photonics Panel: Which Model When? Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence ® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments.
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