Indium experts will present at Electronics in Harsh Environments Conference
Summary
Vijays presentation, titled "Electrification & Automotive Power Electronics – Innovative High-Reliability Solder Materials," will spotlight interconnect solder materials tailored to meet the increasingly stringent demands arising from heightened electrification in automotive and other power electronics sectors. “Mission profiles have become harsher with higher service temperatures, increased cycles, and lower Rth,” said Vijay. This means that the interconnect solder materials for substrate-attach, clip-attach, and module-attach will need to be designed for the newer requirements.” Leading the applications engineering team for clients across Europe, Africa, and the Middle East, Vijay specialises in automotive, industrial, and RF applications encompassing PCBA and power electronics. Dr. Ronald Lasky will conduct a workshop and presentation at the conference: • Testing and Evaluation of Solders for Reliability in Harsh Environments • Thermal Interface Materials (TIMs): Their Status and Applications in 2024 The Testing and Evaluation workshop, designed for intermediate-level participants, will delve into all aspects of selecting and implementing solder paste for achieving high reliability and yields in challenging environments. Dr. Lasky, a senior technologist at Indium Corporation and a professor of engineering at Dartmouth College, brings over 30 years of experience in electronics and optoelectronics packaging at renowned companies like IBM, Universal Instruments, and Cookson Electronics.