Cadence Targets Automotive Market Demands with UCIe

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Cadence has become a contributor-level member of the Automotive Working Group in the Universal Chiplet Interconnect Express (UCIe) Consortium. Last year, the Consortium ratified the UCIe specification, which was established to standardize a die-to-die interconnect for chiplet components from multiple vendors. Cadence currently actively engages in the electrical, form factor and compliance, manageability and security, protocol, systems and software, and marketing working groups to help steer and develop the new chiplet standard. There was a peak attendance of almost 100 people, and the goal to set up an Automotive Working Group in UCIe received presentations from multiple companies. As a part of ECN1 in the next UCIe Rev 1.1 version of the specification, the main data path can have CRC and retry implemented for a streaming controller.

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