Qualcomm Unveils Breakthrough Wi-Fi Technology & Intros New AI-Ready IoT
Summary
The new Qualcomm® QCC730 Wi-Fi solution and Qualcomm® RB3 Gen 2 Platform provide critical upgrades to enable on-device AI, high-performance, low-power processing, and connectivity for the latest IoT products and applications. Qualcomm Technologies also offers a family of IoT connectivity products including QCC711, a tri-core ultra-low power Bluetooth® Low Energy SoC and QCC740, an all-in-one solution supporting Thread, Zigbee, Wi-Fi, and Bluetooth. RB3 Gen 2 features support for Qualcomm® Linux®—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies IoT platforms. It offers a unified Linux distribution that caters to multiple SoCs, starting with the QCS6490 processor, featuring essential components like the Long-Term Support (LTS) kernel, to enable a consistent and superior developer experience. At Embedded World, we look forward to showcasing our latest technologies and collaborating with our ecosystem partners to help them to continue to bring new and exciting IoT products to the industry.