Newly integrated IIoT capabilities create added value
Summary
The showcase will emphasise enhanced performance, energy efficiency, and the integration of advanced IIoT and security features, marking a first in the Computer-on-Module (COM) market. These advancements aim to elevate the readiness of COMs for applications, facilitating the development of modern, multifunctional, and fully connected embedded and IIoT devices. We look forward to showcasing the value these new functionalities provide to our OEM customers at embedded world," said Tim Henrichs, Vice President of Marketing at congatec. The congatec ecosystem includes tailored cooling solutions, carrier boards for straightforward evaluation and application design, software support, and personalised integration services. Additionally, congatec’s testing and design services offer OEMs time and effort savings, making module integration more straightforward and secure, thus accelerating time-to-market, and enabling customers to navigate rapid innovation cycles effectively.