ASMPT unveil one of its most advanced die bonding systems
Summary
The NOVA Pro, he explains, is capable of producing components for 400/800 Gigabit/sec networks and co-packaged optics, meeting the increasing needs of the industry. The machines exceptional placement accuracy is achieved through a unique dynamic alignment method combined with laser-based substrate heating technology. The NOVA Pro also features a substantial substrate area of 550 × 600 mm, catering to the advanced packaging applications market. Johann Weinhaendler asserts that choosing the NOVA Pro means benefiting from the extensive experience of a market leader committed to achieving zero defects per million opportunities (DPMO). He highlights the machines high precision and performance reserves, along with its versatile fixation and bonding options, making it a sound investment for the future.