Si2 Compact Model Coalition Releases SPICE Model for Advanced IC Designs
Summary
John Ellis, Si2 president and CEO, said FinFET is the transistor design that powers the industry along Moore’s Law to advanced leading-edge integrated circuits, including the latest 7nm chips used in every new smartphone, tablet, server, and personal computer. FinFET was named by Dr. Chenming Hu, a National Medal of Technology and Innovation recipient and professor emeritus in the Electronic Engineering and Computer Science Department at UC Berkeley. “This new release will benefit all BSIM-CMG users in its myriad applications.” Through the CMC—and working under Si2’s anti-trust umbrella as a collaborative R&D joint venture—university researchers, simulation software suppliers, fabless, foundry and integrated device manufacturers team up to produce a variety of industry-standard models. These changes can have important implications in shortening design time and ensuring first silicon success for a wide variety of products.” Enhancements include improvements to the thermal noise model and the introduction of gate current scaling factors. Founded in 1988, Si2 is a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.