ATS Releases fanSINK Fan-Ready Heat Sink Solution with maxiGRIP Heat Sink Clip for High Performance
Summary
Norwood, MA, October 09, 2010 --( Applications that would require fanSINK™ are generally those where air flow must be directed to a very hot semiconductor in order for it to operate at its fastest, rated specification.Also, if a system chassis hasn’t been optimized for thermal management, an active heat sink, such as fanSINK™, can act as a local air mover, cooling a specific chip that was untouched before.The fanSINK™ features a cross cut, straight fin heat sink offering omni-directional air flow for optimum thermal performance independent of the PCB layout.Attaching the fanSINK™ to a component is accomplished with the included maxiGRIP™ heat sink clip.Applications that would require fanSINK™ are generally those where air flow must be directed to a very hot semiconductor in order for it to operate at its fastest, rated specification.Also, if a system chassis hasn’t been optimized for thermal management, an active heat sink, such as fanSINK™, can act as a local air mover, cooling a specific chip that was untouched before.