StenTech wins Technology Award for advanced nano coating stencils

▤ Summary

As electronic packaging continuously evolves towards smaller sizes, it demands more accurate solder paste deposition in line with the changing IPC standards. This technology is characterised by its anti-adhesion properties, repelling solder flux and facilitating superior paste transfer. The Advanced Nano Coating by StenTech can improve transfer efficiency by up to 25%, significantly reducing bridging and paste-related defects. Its ‘non-stick’ feature also means less underside cleaning is required, leading to better yields and lower costs for rework and touch-ups. The company was instrumental in introducing Fibre Diode lasers to North America, marking a significant advancement in the industry.

▦ Linked Companies