New thermal conductive gap filler pad from Parker
Summary
With the highest available thermal conductivity in its product family, THERM-A-GAP PAD 80 also maintains low compression forces and conformability between mating surfaces. Very low compression force means the product will deflect under assembly pressure, minimising stress on components, soldered joints, and PCB leads. The material also exhibits low silicone oil bleeding, thus minimising the potential for greasy residues to accumulate on the surface of the heatsink or substrate during use. Oil bleed from inferior thermal gap filler pads can promote reduced electrical performance through lower surface resistance and breakdown voltage. “We know that the engineering demands in devices such as these require thermal interface materials with superior performance characteristics,” says explains Ben Nudelman, global market manager, Chomerics Division.